topcell name:   process:   delivery & invoicing




Дата канвертавання17.04.2016
Памер42.22 Kb.
CMP ORDER FORM FOR ICs MANUFACTURING

version 20 July 2012
CMP RUN:       TOPCELL NAME:       PROCESS:      
DELIVERY & INVOICING
CIRCUIT'S PURPOSE:  Education  Research  Industry
INSTITUTION/COMPANY:      

DELIVERY TO: Name:       Phone:      

Institution/company:       Fax:      

Full address (no PO box):      

     

     


     

     


SPECIAL REQUEST ON DELIVERY:  yes  no

If no, circuits will be sent by courier service (UPS) with our standard ‘invoice for customs’ for foreign countries.

     
INVOICE TO: Name:       VAT id:      

E-mail:       (Europe only)

Institution/Company:       Fax:      

Address:       Phone:      

      P.O. number:      

     

     



CIRCUIT SIZE IN MICRONS:

DeltaX =      


DeltaY =      

Reserved to CMP

area:
price:




NUMBER OF PARTS(1) Bare dies:       Packaged:      
PACKAGE:      

price:

Bonding diagram(2):  free  imposed
lids:  removable  sealed






BULK MICROMACHINING(3)  yes  no

price:



COLOUR PLOTS:  yes  no

number:   


price:



NON-STANDARD DIE THICKNESS(4):      µ

ADDITIONAL SERVICES(5):

     

price:

price:
shipment:


Total:





By signing the present order form, the responsible person accepts the Terms and Conditions that are in http://cmp.imag.fr/products/terms

Name and signature of the responsible person:




Name:       date:       signature:





CMP ORDER FORM FOR ICs MANUFACTURING

version 20 July 2012
CMP RUN:       TOPCELL NAME:       PROCESS:      
TECHNICAL INFORMATION
TECHNICAL ENQUIRIES(6): Name:       Phone:      
E-mail:       Fax:      
CIRCUIT TRANSFER(9):  ftp  E-mail  tape  CDROM
DESCRIPTION FORMAT(7):  GDSII  CIF  DEF  CADENCE data base
CAD TOOL:       version:      
DESIGN KIT:       version:      
DRC VIOLATIONS:  yes  no If you request DRC violations, please make a case overleaf.
LIBRARY CELL REPLACEMENT REQUIRED(8):  yes  no

(make a list of used libraries)

LIBRARY NAME version

           

           

           

           

           

           

           

           

           

           

           

           

           

           


LOW VOLUME PRODUCTION EXPECTED?  yes  perhaps  no
VERSION OF DESIGN THAT SHOULD BE PRODUCED:  this one after test  an improved one
START PRODUCTION:  in next 6 months  < 1 year  > 1 year
EXPECTED NUMBER OF CIRCUITS:  < 100  < 1000  < 10000  > 10000

CIRCUIT FUNCTION (a few lines in English. Mandatory for non E.U. countries, used for export regulation. Mandatory for technologies of STMicroelectronics – Will be published in the CMP annual repport)

     
CMP ORDER FORM FOR ICs MANUFACTURING



version 20 July 2012
DO NOT SEND THIS PAGE
RESERVATION REQUESTS

For technologies of STmicroelectronics and of TriQuint you must send a reservation request one month before the deadline. Please contact us for the document.


PACKAGES

Packaging service is available if you are following packaging rules of CMP. Prices, list of packages and cavity maps are in:

http://cmp.imag.fr -> PRODUCTS -> Packaging Assembly

http://cmp.imag.fr -> Packaging list and prices


Contact us for unlisted ceramic packages, we will check with our subcontractors.
Contact us for plastic packages. Small sets of plastic packages are possible. Main packages are SOIC, SSOP, LPCC (leadless), QFP, PLCC and EDQUAD (thermal solution). NB: design your pad ring according to the chosen package. Packaging rules for plastic are more strict than the ones for ceramic packages.
NOTES
(1) Default is 25 bare dies for our main technologies. Additional dies, color plots and packaging are charged.
(2) Free means that CMP will make a bonding diagram and send it to you for approval. Note that CMP can't make bonding diagrams that doesn't match the packaging rules. If you send your bonding diagram please clearly identify pad 1 in your circuit.
(3) For micromechanical systems only.
(4) Standard die thicknesses (T) are as following. You can request a smaller thickness for your application. Contact us for cost and delay. “T*” means that die thickness can't be changed.

austriamicrosystems: 0.35µ: T= 530µ

STMicroelectronics: 130nm: T= 375µ 65nm: T=250µ 40nm: T= 250µ 28nm: T=250µ

TriQuint: TQP15: T*= 100µm


(5) If you need any other service, contact us to check if we can provide it.
(6) The person given on the form under the heading “TECHNICAL ENQUIRIES” must be rapidly available for questions and corrections of the design. The designer is generally the best choice.
(7) Main format is GDSII. You must contact CMP for agreement if you use another format.
(8) Layout descriptions of library cells of STMicroelectronics contain only metal layers. For these technologies, library cells have to be replaced by the full layout version. You must request replacement and provide CMP with the list of used libraries and their versions.

NB: names of standard cells are reserved names. Using them for naming custom cell is forbidden otherwise custom cell will be overwritten by standard cell.

Example of request of “LIBRARY CELL REPLACEMENT” for a circuit in HCMOS9GP technology of STMicroelectronics:

IOLIB_65_M6_LL version 7.1

COR9GPLL version 4.1



DPHS9gp_1024x32m16d4_L version DPHS_100327_1
(9) Standard is ftp, contact CMP to get an account and a password. Email transfer without an authorization from CMP is forbidden.


Check notes page 3 Page


База данных защищена авторским правом ©shkola.of.by 2016
звярнуцца да адміністрацыі

    Галоўная старонка